Staff at Housel Dermatology, P.C.
All the professionals at Housel Dermatology maintain the highest levels of accreditation, are Board Certified and Fellowship trained, and pursue ongoing education to stay abreast of the latest trends in dermatology.
Joseph P. Housel, MD
Dr. Housel is a Board Certified Dermatologist and fellowship trained Mohs Micrographic and Reconstructive Surgeon.
Dr. Joseph Housel grew up the youngest of six children in Rochester, NY. He began his studies at Binghamton University where he received his degree in psychology. After graduating from Binghamton University Dr. Housel worked at the University of Rochester, where he met his wife Kimberly, a native of Syracuse.
Dr. Housel went on to attend the University of Buffalo Medical School, graduating with the highest honors, Summa Cum Laude. He was inducted into the Medical Honor Society, Alpha Omega Alpha. During this time he also received his Masters in Business Administration, graduating with honors, and was inducted into the Business Honor Society, Phi Beta Kappa.
Following medical school, Dr. Housel completed his internship at the University of Rochester. He subsequently returned to Buffalo where he completed a clinical and research fellowship in cutaneous oncology and photodynamic therapy at Roswell Park Cancer Institute. Dr. Housel continued on with specialty training in dermatology at the University of Buffalo. He was selected as chief resident during his final year. Following this, Dr. Housel was chosen for a prestigious Mohs Micrographic and Reconstructive fellowship at Roswell Park Cancer Institute under the direction of Dr Nathalie Zeitouni.
During his career, Dr. Housel has authored many journal articles as well as textbook chapters.
Outside of work, Dr. Housel and his wife have many interests
and are very busy with their four young children. They enjoy running, biking, snowboarding, hiking, and spending quality time with family. They look forward to returning to the Syracuse area where Kimberly’s parents and brother currently reside.